Assembly and qualification procedures of 2S modules and high rate tests of the CMS Binary Chip for the Phase 2 Upgrade of the CMS Outer Tracker

In the scope of this thesis several assembly steps and qualification procedures of 2S modules were developed. Several test stations were developed, programmed and commissioned to guarantee a high assembly quality. This includes test stations that verify the functionality of the sensors and final modules as well as their assembly precision. In further investigations the radiation hardness of the wire-bond encapsulation material, which is applied on the readout wire-bonds for protection, was tested.